A metallization and bonding approach for high performance carbon nanotube thermal interface materials

Nanotechnology

Volumn 21, Issue 44, 2010, Pages

  Cross, Robert ^a   Cola, Baratunde A ^b   Fisher, Timothy ^b   Xu, Xianfan ^b   Gall, Ken ^c   Graham, Samuel ^a,c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b PURDUE UNIVERSITY   (United States)

^c Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIE ATTACHMENT; ELECTRONIC COMPONENT; GROWTH SUBSTRATES; METALLIZATIONS; METALLIZED SUBSTRATES; PHOTOACOUSTIC TECHNIQUES; ROOM TEMPERATURE; SI SUBSTRATES; THERMAL INTERFACE MATERIALS; THERMAL RESISTANCE; THERMAL RESISTANCE MEASUREMENT; VERTICALLY ALIGNED CARBON NANOTUBE;

CARBON NANOTUBES; DIES; ELECTRONIC EQUIPMENT; HEAT RESISTANCE; METALLIZING; TENSILE STRENGTH; TENSILE TESTING; THERMAL INSULATING MATERIALS;

SUBSTRATES;

EID: 77958544152     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/21/44/445705     Document Type: Article

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