Towards a thermal Moore's law

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 3, 2007, Pages 462-474

  Krishnan, Shankar ^a,b   Garimella, Suresh V ^a   Chrysler, Gregory M ^c   Mahajan, Ravi V ^c  

^a PURDUE UNIVERSITY   (United States)

^b LUCENT TECHNOLOGIES   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

Density factor; Power density; Thermal design power; Thermal resistance; Thermoelectrics

Indexed keywords

HEAT LOSSES; HEAT RESISTANCE; HEAT SINKS; MICROPROCESSOR CHIPS; STANDBY POWER SYSTEMS; TRANSISTORS;

DENSITY FACTOR; MOORE'S LAW; THERMAL DESIGN POWER;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 34548151175     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.898517     Document Type: Article

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