Kinetic model for dependence of thin film stress on growth rate, temperature, and microstructure

Journal of Applied Physics

Volumn 111, Issue 8, 2012, Pages

  Chason, E ^a   Shin, J W ^b   Hearne, S J ^c   Freund, L B ^d  

^a Brown University   (United States)

^b Novellus   (United States)

^c SANDIA NATIONAL LABORATORIES   (United States)

^d University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTINUOUS FILMS; DIFFERENT MECHANISMS; DIMENSIONLESS PARAMETERS; GRAIN SIZE; ISOLATED ISLANDS; KINETIC MODELS; MATERIAL PARAMETER; STEADY STATE STRESS; STEADY-STATE REGIME; STRESS DEPENDENCE; STRESS EVOLUTION; STRESS GENERATION; STRESS STATE; THIN FILM STRESS; TRIPLE JUNCTION;

DEPOSITION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; GROWTH RATE; MICROSTRUCTURE; THIN FILMS;

VAPOR DEPOSITION;

EID: 84860506926     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4704683     Document Type: Article

References (30)

1. R. Abermann and R. Koch, Thin Solid Films 129, 71 (1985). 10.1016/0040-6090(85)90096-3
2. R. Koch, J. Phys. Condens. Matter 6, 9519 (1994). 10.1088/0953-8984/6/45/ 005
3. M. F. Doerner and W. D. Nix, CRC Crit. Rev. Solid State Mater. Sci. 14, 225 (1988). 10.1080/10408438808243734
4. A. L. Shull and F. Spaepen, J. Appl. Phys. 80, 6243 (1996). 10.1063/1.363701
5. J. A. Floro, S. J. Hearne, J. A. Hunter, P. Kotula, E. Chason, S. C. Seel, and C. V. Thompson, J. Appl. Phys. 89, 4886 (2001). 10.1063/1.1352563
6. J. A. Floro, MRS Bull. 27, 19 (2002). 10.1557/mrs2002.15
7. S. J. Hearne and J. A. Floro, J. Appl. Phys. 97, 014901 (2005). 10.1063/1.1819972
8. C. Friesen and C. V. Thompson, Phys. Rev. Lett. 93, 056104 (2004). 10.1103/PhysRevLett.93.056104
9. A. L. Del Vecchio and F. Spaepen, J. Appl. Phys. 101, 063518 (2007). 10.1063/1.2712150
10. J. Leib, R. Monig, and C. V. Thompson, Phys. Rev. Lett. 102, 256101 (2009). 10.1103/PhysRevLett.102.256101
11. R. W. Hoffman, Thin Solid Films 34, 185 (1976). 10.1016/0040-6090(76) 90453-3
12. W. D. Nix and B. M. Clemens, J. Mater. Res. 14, 3467 (1999). 10.1557/JMR.1999.0468
13. L. B. Freund and E. Chason, J. Appl. Phys. 89, 4866 (2001). 10.1063/1.1359437
14. R. C. Cammarata, T. M. Trimble, and D. J. Srolovitz, J. Mater. Res. 15, 2468 (2000). 10.1557/JMR.2000.0354
15. F. Spaepen, Acta Mater. 48, 31 (2000). 10.1016/S1359-6454(99)00286-4
16. E. Chason, B. W. Sheldon, L. B. Freund, J. A. Floro, and S. J. Hearne, Phys. Rev. Lett. 88, 156103 (2002). 10.1103/PhysRevLett.88.156103
17. C. Friesen, S. C. Seel, and C. V. Thompson, J. Appl. Phys. 95, 1011 (2004). 10.1063/1.1637728
18. A. Rajamani, B. W. Sheldon, E. Chason, and A. F. Bower, Appl. Phys. Lett. 81, 1204 (2002). 10.1063/1.1494459
19. J. S. Tello, A. F. Bower, E. Chason, and B. W. Sheldon, Phys. Rev. Lett. 98, 216104 (2007). 10.1103/PhysRevLett.98.216104
20. C. Pao, S. M. Foiles, E. B. Webb, D. J. Srolovitz, and J. A. Floro, Phys. Rev. Lett. 99, 036102 (2007). 10.1103/PhysRevLett.99.036102
21. L. B. Freund and S. Suresh, Thin Film Materials (Cambridge University Press, 2003).
22. R. Koch, D. Hu, and A. K. Das, Phys. Rev. Lett. 94, 146101 (2005). 10.1103/PhysRevLett.94.146101
23. J. W. Shin and E. Chason, Phys. Rev. Lett. 103, 056102 (2009). 10.1103/PhysRevLett.103.056102
24. P. R. Guduru, E. Chason, and L. B. Freund, J. Mech. Phys. Solids 51, 2127 (2003). 10.1016/j.jmps.2003.09.013
25. A. Bhandari, S. J. Hearne, B. W. Sheldon, and S. K. Soni, J. Electrochem. Soc. 156, D279 (2009). 10.1149/1.3142363
26. B. W. Sheldon, K. H. A. Lau, and A. Rajamani, J. Appl. Phys. 90, 5097 (2001). 10.1063/1.1412577
27. M. J. Rost, Phys. Rev. Lett. 99, 266101 (2007). 10.1103/PhysRevLett.99. 266101
28. T. K. Bhandakkar, E. Chason, and H. Gao, Philos. Mag. 90, 3037 (2010). 10.1080/14786431003773007
29. M. J. Buehler, A. Hartmaier, and H. Gao, J. Mech. Phys. Solids 51, 2105 (2003). 10.1016/j.jmps.2003.09.024
30. L. Zepeda-Ruiz, E. Chason, G. Gilmer, Y. Wang, H. Xu, A. Nikroo, and A. Hamza, Appl. Phys. Lett. 95, 151910 (2009). 10.1063/1.3246791