Analytical model of transient compressive stress evolution during growth of high diffusivity thin films on substrates

Philosophical Magazine

Volumn 90, Issue 22, 2010, Pages 3037-3048

  Bhandakkar, Tanmay K ^a   Chason, Eric ^a   Gao, Huajian ^a  

^a Brown University   (United States)

Author keywords

Analytical model; Diffusion; Grain boundary; Thin film stresses; Thin films; Volmer Weber growth

Indexed keywords

ANALYTICAL MODEL; CLOSED-FORM ANALYTICAL SOLUTIONS; DIFFUSIVITIES; EXPERIMENTAL DATA; GRAIN BOUNDARY DIFFUSIVITY; GROWTH OF THIN FILMS; THIN FILM STRESS; THIN FILM STRESSES; TRANSIENT COMPRESSIVE STRESS; TRANSIENT STRESS;

BIOLOGY; COMPRESSIVE STRESS; COMPUTER SIMULATION; DIFFUSION; FILM GROWTH; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; MODELS; NUMERICAL ANALYSIS; TENSILE STRESS; THIN FILMS; TIN; VAPOR DEPOSITION;

GRAIN GROWTH;

EID: 77953484761     PISSN: 14786435     EISSN: 14786443     Source Type: Journal    
DOI: 10.1080/14786431003773007     Document Type: Article

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