Electrochemical behavior of a new Sn3.5Ag0.5Cu composite solder

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 1013-1017

  Tsao, L C ^a   Lo, T T ^b   Peng, S F ^c   Chang, S Y ^d  

^a NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

^c NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^d NONE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDERS; CORROSION BEHAVIOR; CORROSION PRODUCTS; ELECTRICAL COMPONENTS; ELECTROCHEMICAL BEHAVIORS; LEAD-FREE; NACL SOLUTION; NANO-TIO; POLARIZATION STUDY; POTENTIODYNAMIC POLARIZATION CURVES; SEM;

CORROSION RESISTANCE; ELECTRONICS PACKAGING; PACKAGING; POLARIZATION; POTENTIODYNAMIC POLARIZATION; SCANNING ELECTRON MICROSCOPY; SODIUM CHLORIDE; TIN; TIN OXIDES; X RAY DIFFRACTION;

SOLDERING ALLOYS;

EID: 78449274241     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582623     Document Type: Conference Paper

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