MEMS Lithography

Handbook of Silicon Based MEMS Materials and Technologies

Volumn , Issue , 2010, Pages 333-348

  Franssila, Sami ^a   Tuomikoski, Santeri ^b  

^a AALTO UNIVERSITY   (Finland)

^b VTI Technologies Oy   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84859299005     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1016/B978-0-8155-1594-4.00022-X     Document Type: Chapter

References (45)

1. Handbook of Photomask Manufacturing Technology 2005, CRC. S. Rizvi (Ed.).
2. Eynon B.G., Wu B. Photomask Fabrication Technology 2005, McGraw-Hill.
3. Moreau W.M. Semiconductor Microlithography 1991, Plenum, (3rd printing).
4. Microlithography Science and Technology 1998, CRC. J.R. Sheats (Ed.).
5. Levinson H.J. Principles of Lithography 2005, SPIE Press, Monograph vol. PM146. second ed.
6. Microlithography: Science and Technology 2007, Marcel Dekker. K. Suzuki, B.W. Smith (Eds.).
7. del Campo A., Greiner C. SU-8: a photoresist for high aspect ratio and 3D submicron lithography. J. Micromech. Microeng. 2007, 17:R81-R95.
8. Miyajima H., Mehregany M. High-aspect-ratio photolithography for MEMS applications. J. Microelectromech. Syst. 1995, 4:220-229.
9. Koukharenko E., Kraft M., Ensell G., Hollinshead N. A comparative study of different thick photoresists for MEMS applications. J. Mat. Sci. Mater. Electron. 2005, 16:741-747.
10. Shaw J., Gelorme J., LaBianca N., Conley W., Holmes S. Negative photoresists for optical lithography. IBM J. Res. Dev. 1997, 41:81-94.
11. Pham N.P., Boellelaard E., Burghartz J., Sarro P. Photoresist coating method for the integration of novel 3-D RF microstructures. J. Microelectromech. Syst. 2004, 13:491-499.
12. Yu L., Lee Y.Y., Tay F.E.H., Iliescu C. Spray coating of photoresist for 3D microstructures with different geometries. J. Phys. Conf. Series 2006, 34:937-942.
13. Abgrall P., Lattes C., Conedera V., Dollat X., Colin S., Gue A.M. A novel fabrication method of flexible and monolithic 3D microfluidic structures using lamination of SU-8 films. J. Micromech. Microeng. 2006, 16:113-121.
14. Stephan K., Pittet P., Renaud L., Kleinemann P., Morin P., Ouaini N., Ferrigno R. Fast prototyping using a dry film photoresist: microfabrication of soft-lithography masters for microfluidics structures. J. Micromech. Microeng. 2007, 17:N69-N74.
15. Bower C.A., Gilchrist K., Lueck M., Stoner B.S. Microfabrication of a fine-pitch high aspect ratio Faraday cup arrays in silicon. Sens. Actuators, A 2007, 137:296-301.
16. Harrison C., Cabral J., Stafford C., Karim A., Amis E. A rapid prototyping technique for the fabrication of solvent-resistant structures. J. Micromech. Microeng. 2004, 14:153-158.
17. Kim E.S., Muller R.S., Hijab R.S. Front-to-backside alignment using resist-patterned etch control and one etching step. J. Microelectromech. Syst. 1992, 1:95-99.
18. Cheng Y., Lin C.-Y., Wei D.-H., Loechel B., Grutzner G. Wall profile of thick photoresist generated via contact printing. J. Microelectromech. Syst. 1999, 8:18-26.
19. Rao V.S., Kripesh V., Yoon S.W., Tay A.A.O. A thick photoresist for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist. J. Micromech. Microeng. 2006, 16:1841-1846.
20. Lee H.S., Yoon J.-B. A simple and effective lift-off with positive photoresist. J. Micromech. Microeng. 2005, 15:2136-2140.
21. van Kessel P.F., Hornbeck L., Meier R., Douglas M. A MEMS-based projection display. Proc. IEEE 1998, 86:1687-1704.
22. Yoon J.-B., Han C.-H., Yoon E., Kim C.-K. Monolithic fabrication of electroplated inductors using three-dimensional photolithography of a thick photoresist. Jpn. J. Appl. Phys. 1998, 37:7081-7085.
23. Song I.-H., Ajmera P.K. Use of photoresist sacrificial layer with SU-8 electroplating mold in MEMS fabrication. J. Micromech. Microeng. 2003, 13:816-821.
24. Nakajima A., Kim P., Honda N., Hikichi K., Esashi M., Tanaka S. Fabrication and high-speed characterization of SU-8 shrouded two-dimensional microimpellers. J. Micromech. Microeng. 2007, 17:S230-S236.
25. Graff M., Mohanty S.K., Moss E., Frazier A.B. Microstenciling: a generic technology for microscale patterning of vapor deposited materials. J. Microelectromech. Syst. 2004, 13:956-962.
26. Kim G.M., van den Boogaart M.A.F., Brugger J. Fabrication and application of a full wafer size micro/nanostencil for multiple length-scale surface patterning. Microelectr. Eng. 2003, 67-68:609-614.
27. Brugger J., Andreoli C., Despont M., Drechsler U., Rothuizen H., Vettiger P. Self-aligned shadow mask technique for patterning deeply recessed surfaces of micro-electro-mechanical systems devices. Sens. Actuators, A 1999, 76:329-334.
28. Lee D.H., Park D.E., Yoon J.B., Kwon S., Yoon E. Fabrication and test of a MEMS combustor and reciprocating device. J. Micromech. Microeng. 2002, 12:26-34.
29. Bischofberger R., Zimmermann H., Staufert G. Low-cost HARMS process. Sens. Actuators, A 1997, 61:392-399.
30. Lorenz H., Despont M., Vettiger P., Renaud P. Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist. Microsyst. Technnol. 1998, 4:143-146.
31. Roth S., Dellmann L., Racine G.-A., de Rooij N. High aspect ratio UV photolithography for electroplated structures. J. Micromech. Microeng. 1999, 9:105-108.
32. Kim K., Park D.S., Lu H.M., Che W., Kim K., Lee J.-B., Ahn C.H. A tapered hollow metallic microneedle array using backside exposure of SU-8. J. Micromech. Microeng. 2004, 14:597-603.
33. Becker E., Ehrfeld W., Hagmann P., Maner A., Munchmeyer D. Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process). Microelectron. Eng. 1986, 4:35-56.
34. Tuomikoski S., Virkkala N., Rovio S., Hokkanen A., Siren H., Franssila S. Design and fabrication of integrated solid-phase extraction-zone electrophoresis microchip. J. Chromatogr. A 2006, 1111:258-266.
35. Yang P., Wang W. A numerical and experimental study on gap compensation and wavelength selection in UV-lithography of ultra-high aspect ratio SU-8 microstructures. Sens. Actuators, B 2005, 110:279-288.
36. Kang W.-K., Rabe E., Kopetz S., Neyer A. Novel exposure methods based on reflection and refraction effects in the field of SU-8 lithography. J. Micromech. Microeng. 2006, 16:821-831.
37. Tuomikoski S., Franssila S. Free-standing SU-8 microfluidic chips by adhesive bonding and release etching. Sens. Actuators, A 2005, 120:408-415.
38. Lee K., LaBianca N., Rishton S., Zohlgharnain S., Gelorme J., Shaw J., Chang H.-P. Micromachining applications of a high resolution ultrathick photoresist. J. Vac. Sci. Technol. B 1995, 13:3012-3016.
39. Bachmann D., Schöberle B., Kühne S., Leiner Y., Hierold C. Fabrication and characterization of folded SU-8 suspensions for MEMS applications. Sens. Actuators, A 2006, 130-131:379-386.
40. Ebefors T., Ulfsted Mattsson J., Kälvesten E., Stemme G. A robust microconveyor realized by arrayed polyimide joint actuators. J. Micromech. Microeng. 2000, 10:337-349.
41. Tuomikoski S., Sikanen T., Ketola R., Kostiainen R., Kotiaho T., Franssila S. Fabrication of enclosed SU-8 tips for electrospray ionization mass spectrometry. Electrophoresis 2005, 26:4691-4702.
42. Nguyen N.-T., Truong T.-Q., Wong K.-K., Ho S.-S., Low C. Micro check valves for integration into polymeric microfluidic devices. J. Micromech. Microeng. 2004, 14:69-75.
43. Wang Z., El-Ali J., Engelund M., Gotsaed T., Perch-Nielsen I., Mogensen K., Snakenborg D., Kutter J., Wolff A. Measurement of scattered light on a microchip flow cytometer with integrated polymer based optical elements. Lab. Chip 2004, 4:372-377.
44. Blanco F., Agirregabiria M., Garcia J., Berganzo J., Tijero M., Ruano J., Aramburu I., Mayora K. Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding. J. Micromech. Microeng. 2004, 14:1047-1056.
45. U. Ostrzinski, M. Heinrich, Development of drying methods for highly viscous photoresists by application of IR radiation (research report), micro resist technology GmbH, 2003.