A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist

Journal of Micromechanics and Microengineering

Volumn 16, Issue 9, 2006, Pages 1841-1846

  Rao, Vempati Srinivasa ^a   Kripesh, Vaidyanathan ^a   Yoon, Seung Wook ^a   Tay, Andrew A O ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROPLATING; FLUIDICS; MOLDS; PHOTORESISTS; SOLDERING;

INTERCONNECTS; LITHOGRAPHY PARAMETERS; PACKAGING TECHNOLOGIES; PHOTORESIST MOLDS;

ELECTRONICS PACKAGING;

EID: 33747242692     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/9/012     Document Type: Article

References (12)

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