Atomic layer deposition of amorphous niobium carbide-based thin film superconductors

Journal of Physical Chemistry C

Volumn 115, Issue 50, 2011, Pages 25063-25071

  Klug, Jeffrey A ^a   Proslier, Thomas ^a   Elam, Jeffrey W ^a   Cook, Russell E ^a   Hiller, Jon M ^a   Claus, Helmut ^a   Becker, Nicholas G ^a,b   Pellin, Michael J ^a  

^a ARGONNE NATIONAL LABORATORY   (United States)

^b ILLINOIS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS CARBON (A-C); CHEMICAL COMPOSITIONS; DC RESISTIVITY; DEPOSITION TEMPERATURES; FILM COMPOSITION; FILM DENSITY; HIGH GROWTH RATE; IMPURITY CONCENTRATION; IN-SITU; LINEAR DEPOSITION; MAGNETOMETRY MEASUREMENTS; NIOBIUM CARBIDE; ROOM TEMPERATURE; STRONG GROWTH; SUPERCONDUCTING CRITICAL TEMPERATURES; SUPERCONDUCTING QUANTUM INTERFERENCE DEVICE; SUPERCONDUCTING TRANSITIONS; THIN-FILM SUPERCONDUCTORS; TRIMETHYLALUMINUM;

AMORPHOUS CARBON; ATOMIC LAYER DEPOSITION; CARBIDES; ELECTRONIC PROPERTIES; GROWTH RATE; IMPURITIES; NIOBIUM; SQUIDS; SUPERCONDUCTIVITY; THICK FILMS; THIN FILMS; VAPOR DEPOSITION;

FILM GROWTH;

EID: 84857331940     PISSN: 19327447     EISSN: 19327455     Source Type: Journal    
DOI: 10.1021/jp207612r     Document Type: Article

References (43)

1. Toth, L. E. Transition Metal Carbides and Nitrides; Refractory materials; Academic Press: New York, 1971; Vol. 7.
2. Pierson, H. O. Handbook of refractory carbides and nitrides: properties, characteristics, processing, and applications; Noyes Publications: Westwood, NJ, 1996.
3. Brungs, A.; York, A.; Green, M. Catal. Lett. 1999, 57, 65-69.
4. Kaloyeros, A.; Hoffman, M.; Williams, W. S. Thin Solid Films 1986, 141, 237-250.
5. Pechen, E. V.; Krasnosvobodtsev, S. I.; Shabanova, N. P.; Ekimov, E. V.; Varlashkin, A. V.; Nozdrin, V. S.; Tschovrebov, A. M.; Golovashkin, A I. Physica C: Supercond. 1994, 235-240, 2511-2512.
6. Spitzer, H. J. J. Vac. Sci. Technol. 1973, 10, 20.
7. Zoita, C. N.; Braic, L.; Kiss, A.; Braic, M. Surf. Coat. Technol. 2010, 204, 2002-2005.
8. Liao, M. Y.; Gotoh, Y.; Tsuji, H.; Ishikawa, J. J. Vac. Sci. Technol. B 2004, 22, L24.
9. Bendavid, A; Martin, P. J.; Kinder, T. J.; Preston, E. W. Surf. Coat. Technol. 2003, 163-164, 347-352.
10. Duhalde, S.; Colaco, R; Audebert, F.; Perrone, A.; Zocco, A. Appl. Phys. A: Mater. Sci. Process. 1999, 69, S569-S571.
11. Ritala, M.; Leskela, M. In Handbook of Thin Film Materials; Nalwa, H. S., Ed.; Academic Press: San Diego, CA, 2001; Vol. 1, pp 103-159.
12. Proslier, T.; Ha, Y.; Zasadzinski, J.; Ciovati, G; Kneisel, P.; Reece, C. E.; Rimmer, R. A; Gurevich, A. V; Cooley, L.; Wu, G; Pellin, M. J.; Norem, J.; Elam, J. W.; Antoine, C. Z. Proceedings of PAC09; Vancouver, BC, Canada, 2009; TU5PFP002.
13. Pajot, F.; Atik, Y.; Evesque, C; Lefranc, S.; Leriche, B.; Torre, J.-P.; Belier, B.; Marsot, N.; Dumoulin, L.; Berge, L.; Piat, M.; Breelle, E.; Prele, D.; Benoit, A; Hoffmann, C; Durand, T.; Camus, P.; Santos, D.; Jin, Y.; Giard, M. J. Low Temp. Phys. 2008, 151, 513-517.
14. Hiltunen, L.; Leskela, M.; Mäkelä, M.; Niinisto, L.; Nykanen, E.; Soininen, P. Thin Solid Films 1988, 166, 149-154.
15. Proslier, T.; Klug, J. A.; Elam, J. W.; Claus, H.; Becker, N. G; Pellin, M.J.J. Phys. Chem. C 2011, 115, 9477-9485.
16. Elers, K-E.; Haukka, S. P.; Saanila, V A.; Kaipio, S.J.; Soininen, P.J. Deposition of transition metal carbides. U.S. Patent No. 6,482,262, Nov 19, 2002.
17. Kim, D.; Kim, Y.; Song, Y.; Lee, B.; Kim, J.; Suh, S.; Gordon, R. J. Electrochem. Soc. 2003, 150, C740-C744.
18. Hoyas, A.; Whelan, C; Schuhmacher, J.; Maex, K; Celis, J. Microelectron. Eng. 2006, 83, 2068-2071.
19. Song, M.; Rhee, S. In ECS Transactions; Honolulu, HI, 2008; Vol. 16, pp 227-236.
20. Song, M.; Rhee, S. J. Electrochem. Soc. 2008, 155, H823-H828.
21. Hossbach, C; Teichert, S.; Thomas, J.; Wilde, L.; Wojcik, H; Schmidt, D.; Adolphi, B.; Bertram, M.; Muhle, U.; Albert, M.; Menzel, S.; Hintze, B.; Bartha, J. J. Electrochem. Soc. 2009, 156, H852-H859.
22. Juppo, M.; Alen, P.; Ritala, M.; Leskela, M. Chem. Vap. Deposition 2001, 7, 211.
23. Alen, P.; Juppo, M.; Ritala, M.; Sajavaara, T.; Keinonen, J.; Leskela, M.J. Electrochem. Soc. 2001, 148, G566.
24. Schmidt, D.; Knaut, M.; Hossbach, C.; Albert, M.; Dussarrat, C.; Hintze, B.; Bartha, J. W. J. Electrochem. Soc 2010, 157, H638-H642.
25. Harkonen, K; Doczy, M.; Lang, T.; Baxter, N. E. Deposition of carbon- and transition metal-containing thin films. U.S. Patent No. 7,198,820, April 3, 2007.
26. Puurunen, R. L.; Lindblad, M.; Root, A; Krause, A O. I. Phys. Chem. Chem. Phys. 2001, 3, 1093-1102.
27. Yamashita, S.; Watanuki, K; Ishii, H; Shiba, Y.; Kitano, M.; Shirai, Y.; Sugawa, S.; Ohmi, T. J. Electrochem. Soc. 2011,158, H93-H96.
28. Elam, J. W.; Groner, M. D.; George, S. M. Rev. Sci. Instrum. 2002, 73, 2981.
29. Bechmann, R Proc. IRE 1956, 44, 1600-1607.
30. Groner, M. D.; Fabreguette, F. H; Elam, J. W.; George, S. M. Chem. Mater. 2004, 16, 639-645.
31. Elers, K-E.; Ritala, M.; Leskela, M.; Rauhala, E. Appl. Surf. Sci. 1994, 82-83, 468-474.
32. Kukli, K; Ritala, M.; Matero, R; Leskela, M. J. Cryst. Growth 2000, 212, 459-468.
33. Tersoff J.; Tu, Y.; Grinstein, G. Appl. Phys. Lett. 1998, 73, 2328.
34. Fairley, N. CasaXPS; Casa Software, Ltd.: Teignmouth, U.K., 2009.
35. McGuire, G E.; Schweitzer, G K; Carlson, T. A. Inorg. Chem. 1973, 12, 2450-2453.
36. Ramqvist, L.; Hamrin, K; Johansson, G; Fahlman, A; Nordling, C.J. Phys. Chem. Solids 1969, 30, 1835-1847.
37. Moulder, J. F.; Stickle, W. F.; Sobol, P. E.; Bomden, K D. Handbook of X-ray Photoelectron Spectroscopy; Chastain, J., Ed.; Perkin-Elmer Corp., Physical Electronics Division: Eden Prairie, MN, 1992.
38. Nefedov, V I.; Buslaev, Y. A; Kohunov, Y. V Zh. Neorg. Khim. 1974, 19, 1166.
39. Darlinski, A; Halbritter, J. Surf. Interface Anal. 1987, 10, 223-237.
40. Geyer-Lippmann, J.; Simon, A; Stollmaier, F. Z. Anorg. Allg. Chem. 1984, 516, 55-66.
41. Kukli, K; Aarik, J.; Adla, A; Forsgren, K; Sundqvist, J.; Harsta, A; Uustare, T.; Mändar, H.; Kiisler, A-A Chem. Mater. 2000, 13, 122-128.
42. Mironov, V L.; Udalov, O. G; Gribkov, B. A; Fraerman, A A. J. Appl. Phys. 2008, 104, 064301.
43. Kaloyeros, A. E.; Eisenbraun, E. Annu. Rev. Mater. Sci. 2000, 30, 363-385.