![]() |
Volumn 16, Issue 4, 2009, Pages 227-236
|
Characteristics of tantalum carbo-nitride thin films deposited with atomic layer deposition process
|
Author keywords
[No Author keywords available]
|
Indexed keywords
AMMONIA;
ATOMS;
CARBIDES;
ELECTRONIC PROPERTIES;
NITRIDES;
OXYGEN;
PHASE COMPOSITION;
SILICON COMPOUNDS;
TANTALUM OXIDES;
THIN FILMS;
CARBIDE PHASE;
DEPOSITION TEMPERATURES;
FILM RESISTIVITY;
NITRIDE THIN FILMS;
PLASMA-ENHANCED ATOMIC LAYER DEPOSITION;
POST-DEPOSITION;
PROCESS PARAMETERS;
REACTIVE GAS;
ATOMIC LAYER DEPOSITION;
|
EID: 63149199486
PISSN: 19385862
EISSN: 19386737
Source Type: Conference Proceeding
DOI: 10.1149/1.2979998 Document Type: Conference Paper |
Times cited : (1)
|
References (14)
|