Enhanced Cu/LCP adhesion by pre-sputter cleaning prior to Cu deposition

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 3, 2005, Pages 495-502

  Howlader, M M R ^a   Iwashita, M ^a   Nanbu, K ^b   Saijo, K ^b   Suga, T ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b Toyo Kohan Co   (Japan)

Author keywords

Adhesion; Deposition; Diffusion; Interfacial reaction; Liquid crystal polymer (LCP); Peel strength; Radio frequency (RF) plasma

Indexed keywords

BONDING; CHEMICAL CLEANING; COPPER; DIFFUSION; ELECTRONICS PACKAGING; HEATING; LIQUID CRYSTAL POLYMERS; PLASMA APPLICATIONS; SPUTTER DEPOSITION; SURFACE REACTIONS; THERMAL EFFECTS;

COPPER DEPOSITION; INTERFACIAL REACTION; PEEL STRENGTH; PRE-SPUTTER CLEANING; RADIO FREQUENCY (RF) PLASMA;

ADHESION;

EID: 24644494787     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.848522     Document Type: Article

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