Low temperature bonded Cu/LCP materials for FPCs and their characteristics

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 760-764

  Nanbu, Kouji ^a   Ozawa, Shinji ^a   Yoshida, Kazuo ^a   Saijo, Kinji ^a   Suga, Tadatomo ^b  

^a Toyo Kohan Co   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

Liquid crystal polymer (LCP); Surface activated bonding (SAB); X ray photoelectron spectrometer (XPS)

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; COPPER ALLOYS; ETCHING; HEAT RESISTANCE; HEAT TREATMENT; HIGH TEMPERATURE EFFECTS; LAMINATING; LOW TEMPERATURE EFFECTS; METAL CLADDING; OXIDATION; X RAY PHOTOELECTRON SPECTROSCOPY;

ION SPUTTERING ETCHING; PEEL STRENGTH; SURFACE ACTIVATED BONDING (SAB); VACUUM CHAMBER;

LIQUID CRYSTAL POLYMERS;

EID: 29244438207     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.859746     Document Type: Article

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