SCOPUS 정보 검색 플랫폼

Journal of Materials Science

Volumn 40, Issue 12, 2005, Pages 3177-3184

Surface activated bonding of LCP/Cu for electronic packaging

(6) Howlader, M M R a Suga, T a Takahashi, A a Saijo, K b Ozawa, S b Nanbu, K b

a UNIVERSITY OF TOKYO (Japan)

b Toyo Kohan Co (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); LAMINATES; PEELING; PRINTED CIRCUIT BOARDS; SURFACE ACTIVE AGENTS; X RAY PHOTOELECTRON SPECTROSCOPY;

HIGH SPEED TRANSMISSION; SMOOTH INTERFACE; SURFACE ACTIVATED BONDING; THERMAL RECONSTRUCTION;

LIQUID CRYSTAL POLYMERS;

EID: 20644459461 PISSN: 00222461 EISSN: None Source Type: Journal
DOI: 10.1007/s10853-005-2681-5 Document Type: Conference Paper

Times cited : (30)

References (13)

1
- 20644467312
- T. SUGA and K. OSTUKA, in Proceedings of 51th IEEE ECTC Conference (2001) p. 1003.
- (2001) Proceedings of 51th IEEE ECTC Conference , pp. 1003
- Suga, T.¹ Ostuka, K.²

2
- 0035790692
- T. SUGA, A. TAKAHASHI, K. SAIJO and S. OOSAWA, in 1st Int. IEEE Conf. Pol. Adhes. Microel. Photon., Polytron. (2001) p. 29.
- (2001) 1st Int. IEEE Conf. Pol. Adhes. Microel. Photon., Polytron. , pp. 29
- Suga, T.¹ Takahashi, A.² Saijo, K.³ Oosawa, S.⁴

3
- 0021510506
- N. J. CHOU, D. W. DONG, J. KIM and A. C. LIU, J. Electrochem. Soc. 131(10) (1984) 2335.
- (1984) J. Electrochem. Soc. , vol.131 , Issue.10 , pp. 2335
- Chou, N.J.¹ Dong, D.W.² Kim, J.³ Liu, A.C.⁴

4
- 3543098538
- P. LAURENS, S. PETIT and F. AREFI-KHONSARI, Plasm. Polym. 8(4) (2003) 281.
- (2003) Plasm. Polym. , vol.8 , Issue.4 , pp. 281
- Laurens, P.¹ Petit, S.² Arefi-Khonsari, F.³

5
- 0001701772
- J. S. CHO, W. K. CHOI, S. K. KOH and K. H. YOON, J. Vac. Sci. Technol B16(3) (1998) 1110.
- (1998) J. Vac. Sci. Technol , vol.B16 , Issue.3 , pp. 1110
- Cho, J.S.¹ Choi, W.K.² Koh, S.K.³ Yoon, K.H.⁴

6
- 0017946533
- J. M. BURKSTRAND. ibid. 15(2) (1978) 223.
- (1978) J. Vac. Sci. Technol , vol.15 , Issue.2 , pp. 223
- Burkstrand, J.M.¹

7
- 84918473489
- N. J. CHOU and C. H. TANG, ibid. A2(2) (1984) 751.
- (1984) Ibid. , vol.A2 , Issue.2 , pp. 751
- Chou, N.J.¹ Tang, C.H.²

8
- 0031556012
- S. K. KOH, S. C. PARK, S. R. KIM, W. K. CHOI, H. J. JUNG and K. D. PAE, J. Appl. Polym. Sci. 64 (1996) 1913.
- (1996) J. Appl. Polym. Sci. , vol.64 , pp. 1913
- Koh, S.K.¹ Park, S.C.² Kim, S.R.³ Choi, W.K.⁴ Jung, H.J.⁵ Pae, K.D.⁶

9
- 0001722965
- G. S. CHANG, K. H. CHAE, C. N. WHANG, E. Z. KURMAEV, D. A. ZATSEPIN, R. P. WINARSKI, D. L. EDERER, A. MOEWES and Y. P. LEE, Appl. Phys. Let. 74(4) (1999) 522.
- (1999) Appl. Phys. Let. , vol.74 , Issue.4 , pp. 522
- Chang, G.S.¹ Chae, K.H.² Whang, C.N.³ Kurmaev, E.Z.⁴ Zatsepin, D.A.⁵ Winarski, R.P.⁶ Ederer, D.L.⁷ Moewes, A.⁸ Lee, Y.P.⁹

10
- 36849117023
- K. L. CHOPRA, L. C. BOBB and M. H. FRANCOMBE, J. Appl. Phys. 34 (1963) 1699.
- (1963) J. Appl. Phys. , vol.34 , pp. 1699
- Chopra, K.L.¹ Bobb, L.C.² Francombe, M.H.³

11
- 0031075050
- R. WEICHENHAIN, D. A. WESNER, W. PFLEGING, H. HORN and E. W. KREUTZ, Appl. Surf. Sci. 109/110 (1997) 264.
- (1997) Appl. Surf. Sci. , vol.109-110 , pp. 264
- Weichenhain, R.¹ Wesner, D.A.² Pfleging, W.³ Horn, H.⁴ Kreutz, E.W.⁵

12
- 0034465084
- V. ZAPOROJTCHENKO, T. STRUNSKUS, K. BEHNKE, C. V. BECHTOLSHEIM, M. KIENE and F. FAUPEL, J. Adhes. Sci. Technol. 14(3) (2000) 467.
- (2000) J. Adhes. Sci. Technol. , vol.14 , Issue.3 , pp. 467
- Zaporojtchenko, V.¹ Strunskus, T.² Behnke, K.³ Bechtolsheim, C.V.⁴ Kiene, M.⁵ Faupel, F.⁶

13
- 20644452935
- K. SAIJO, K. NANBU, K. YOSHIDA, S. OZAWA and T. SUGA, in Int. Confer. Electron. Packag. ICEP, (2004) p. 283.
- (2004) Int. Confer. Electron. Packag. ICEP , pp. 283
- Saijo, K.¹ Nanbu, K.² Yoshida, K.³ Ozawa, S.⁴ Suga, T.⁵

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.