SCOPUS 정보 검색 플랫폼

Volumn 110, Issue 12, 2011, Pages

In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP SOLDER JOINTS; IN-SITU OBSERVATIONS; MOLAR HEAT; THERMOMIGRATION; VACANCY FLUX; VOID FORMATION;

ATOMS; FLIP CHIP DEVICES;

TIN;

EID: 84855313812 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.3671404 Document Type: Article

Times cited : (56)

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