Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers

Microelectronics Reliability

Volumn 52, Issue 1, 2012, Pages 206-211

  Ni, Mingzhi ^a,b   Li, Ming ^a,b   Mao, Dali ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b Shanghai Jiao Tong University   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION IMPROVEMENT; ADHESIVE FAILURE; BUTTON SHEAR TESTS; COHESIVE FAILURES; EPOXY MOLDING COMPOUNDS; FAILURE MODE TRANSITION; LEAD FRAME; MECHANICAL INTERLOCKING; NICKEL LAYERS; PRACTICAL METHOD; PRE-PLATED LEADFRAME;

ELECTRONICS PACKAGING; MOLDING; SHEET MOLDING COMPOUNDS; SURFACE ROUGHNESS;

ADHESION;

EID: 84155172364     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.07.095     Document Type: Conference Paper

References (20)

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