Field failure due to creep corrosion on components with palladium pre-plated leadframes

Microelectronics Reliability

Volumn 43, Issue 5, 2003, Pages 775-783

  Zhao, Ping ^a   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CREEP; ELECTRIC CONNECTORS; ELECTRIC CONTACTS; MICROELECTRONICS; PALLADIUM; PLATING; TELECOMMUNICATION EQUIPMENT;

MIXED FLOWING GAS (MFG);

CORROSION;

EID: 0037651062     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00064-7     Document Type: Article

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