Reliability of Pb-free preplated leadframe under atmosphere and accelerated aging test

IEEE Transactions on Device and Materials Reliability

Volumn 6, Issue 1, 2006, Pages 33-41

  Park, Jongwoo ^a   Kim, Young Hee ^a   Wang, Seung Woog ^a   Lee, Seung Woo ^a   Jeon, Hyungoo ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

Accelerated aging test; Corrosion; Cupric oxide; Cuprous oxide; Cuprous sulfide; Mixed flow gas test; Pb free preplated leadframe (PPF); Reliability; Tarnish product

Indexed keywords

COPPER; CORROSION; DISCOLORATION; LEAD; NICKEL; RELIABILITY; SHEAR STRESS; SUBSTRATES;

ACCELERATED AGING TEST; CUPRIC OXIDE; CUPROUS SULFIDE; MIXED FLOWING GAS (MFG) TEST; PB-FREE PREPLATED LEAD-FRAME (PPF);

AGING OF MATERIALS;

EID: 33645831772     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2006.870341     Document Type: Article

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