Current technologies for plating lead frames - a comparison of pre-plated lead frames versus spot selective silver and tin lead

Transactions of the Institute of Metal Finishing

Volumn 77, Issue 4, 1999, Pages

  Burling, S A ^a   Stafford, P ^b  

^a Engelhard Clal Ltd   (United Kingdom)

^b BASF SE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CORROSION RESISTANCE; CRACK PROPAGATION; DUCTILITY; LEAD PLATING; PALLADIUM; PALLADIUM ALLOYS; POROSITY; SILVER PLATING;

PALLADIUM PREPLATED LEAD FRAMES (PPLF);

PLATING;

EID: 0032689718     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. Yasan Kalo, N.E. Chemcat. Application of High Speed Silver Plating Process and High Speed Solder Plating Process. Transactions of the Metal Finishers Assoc of India, 5, (4) Oct. 1996.
2. Summit Corporation of America. Public report on palladium plated lead frame trials.
3. Sony Corporation - Quality and reliability further improved through the use of Sony's proprietary technology. S-Pd P.P.F. (Palladium pre-plated lead frame).
4. Joe Bolich - Engelhard Corporation, U.S.A. useful and helpful information and guidance.