Surface characterization and adhesion of black-oxide-coated copper substrate: Effect of surface hardening processes

Journal of Adhesion Science and Technology

Volumn 18, Issue 9, 2004, Pages 983-1001

  Lebbai, Mohamed ^a   Kim, Jang Kyo ^a,b   Szeto, W K ^a   Wu, Jingshen ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b NXP SEMICONDUCTORS   (Netherlands)

Author keywords

Adhesion; Copper oxide; Failure mode; Surface characteristics; Surface hardening process

Indexed keywords

ADHESION; AUGER ELECTRON SPECTROSCOPY; BOND STRENGTH (CHEMICAL); COPPER OXIDES; EPOXY RESINS; HARDENING; OXIDATION; SATURATION (MATERIALS COMPOSITION); SCANNING ELECTRON MICROSCOPY; SUBSTRATES; SURFACE ROUGHNESS; THERMODYNAMICS; X RAY PHOTOELECTRON SPECTROSCOPY; BOND STRENGTH (MATERIALS); CONTACT ANGLE; FAILURE MODES; PROTECTIVE COATINGS; THICKNESS MEASUREMENT;

FAILURE MODE; MECHANICAL INTERLOCKING; SURFACE CHARACTERISTICS; SURFACE HARDENING PROCESS;

SURFACE CHEMISTRY; HARDENING;

AFM; BLACK COPPER; BLACK OXIDE COATING; COATED SURFACE; COATING THICKNESS; CONTACT ANGLE GONIOMETRY; COPPER SUBSTRATES; CUPRIC OXIDE; FUNCTIONAL DEPENDENCE; MECHANICAL INTERLOCKING; OXIDATION TIME; OXIDE COATING; OXIDE SUBSTRATES; OXIDE THICKNESS; SURFACE CHARACTERISTICS; SURFACE CHARACTERIZATION; SURFACE CONTAMINATIONS; SURFACE FREE ENERGY; SURFACE HARDENING; SURFACE HARDENING PROCESS; THERMODYNAMIC CHARACTERISTICS; XRD;

EID: 3142711412     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/1568561041257513     Document Type: Article

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