Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

Journal of the Electrochemical Society

Volumn 152, Issue 6, 2005, Pages

  Siau, Sam ^a   Vervaet, Alfons ^a   Van Vaeck, Luc ^b   Schacht, Etienne ^a   Demeter, Ulric ^a   Van Calster, Andre ^a  

^a GHENT UNIVERSITY   (Belgium)

^b UNIVERSITY OF ANTWERP   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELECTRODEPOSITION; EPOXY RESINS; MICROELECTRONICS; OXIDATION; POLYMERS; SURFACE TENSION;

ASPERTIES; COHESIVE FAILURES; ELECTRON TRANSFER; EPOXY SURFACES;

COPPER;

EID: 22544447807     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1904911     Document Type: Article

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