Thiol-based self-assembly nanostructures in promoting interfacial adhesion for copper-epoxy joint

Applied Physics Letters

Volumn 94, Issue 26, 2009, Pages

  Wong, Cell K Y ^a   Yuen, Matthew M F ^a   Xu, Bing ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION ENHANCEMENT; ADHESION PROMOTION; CHEMICAL BONDINGS; COPPER SUBSTRATES; ELECTRONIC DEVICE; EPOXY INTERFACE; INTERFACIAL ADHESIONS; MOLECULAR LAYER; NANO-SIZED FEATURES;

ADHESION; CHEMICAL BONDS; NANOSTRUCTURES; SELF ASSEMBLY; SUBSTRATES;

COPPER;

EID: 67649961457     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3167358     Document Type: Article

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