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Volumn , Issue , 1998, Pages 478-491
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New epoxy molding compounds for SMT with pre-plated lead-frame system
a a a a a a |
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
COSTS;
ELECTRONICS PACKAGING;
GOLD ALLOYS;
HEAT RESISTANCE;
INDUSTRIAL ELECTRONICS;
MOLDING;
SEMICONDUCTOR DEVICE MANUFACTURE;
SHEET MOLDING COMPOUNDS;
SURFACE MOUNT TECHNOLOGY;
ADHESION PROMOTER;
AFFORDABLE PRICES;
EPOXY MOLDING COMPOUNDS;
EPOXY RESIN SYSTEM;
MATERIAL DEVELOPMENT;
OPTIMUM RELIABILITY;
PERFORMANCE PROBLEMS;
SEMICONDUCTOR INDUSTRY;
EPOXY RESINS;
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EID: 84885061557
PISSN: 10898190
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IEMT.1998.731175 Document Type: Conference Paper |
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Times cited : (5)
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References (0)
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