Study on the adhesion between epoxy molding compound and nanocone-arrayed Pd preplated leadframes

Journal of Electronic Materials

Volumn 36, Issue 12, 2007, Pages 1594-1598

  Hang, Tao ^a   Ling, Huiqin ^a   Xiu, Zhengji ^a   Li, Ming ^a   Mao, Dali ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Adhesion; Electrodeposition; Nanocone arrayed; Pd preplated leadframe

Indexed keywords

EPOXY MOLDING; LEAD FRAMES; NANOCONES;

ADHESION; DIGITAL INTEGRATED CIRCUITS; ELECTRODEPOSITION; EPOXY RESINS; METAL MOLDING; PALLADIUM;

GOLD;

EID: 36148973521     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0292-4     Document Type: Article

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