Plasma cleaning of copper leadframe with Ar and Ar/H2 gases

Surface and Coatings Technology

Volumn 112, Issue 1-3, 1999, Pages 245-249

  Hsieh, J H ^a   Fong, L H ^a   Yi, S ^b   Metha, G ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Adhesion; Leadframe; Package; Plasma cleaning

Indexed keywords

ADHESION; ARGON; BOND STRENGTH (MATERIALS); HYDROGEN; METAL CLEANING; METAL MOLDING; METAL TESTING; OXIDATION; PLASMA APPLICATIONS;

LEADFRAMES; PLASMA CLEANING; PULL TESTING;

COPPER ALLOYS;

EID: 0033077681     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(98)00779-8     Document Type: Article

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