Nickel/palladium finish for leadframes

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 1, 1999, Pages 99-103

  Abbott, Donald C ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

METAL FINISHING; PALLADIUM;

LEADFRAME PLATING;

NICKEL PLATING;

EID: 0033310473     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.759358     Document Type: Article

References (10)

1. D. C. Abbott, R. M. Brook, N. McLelland, and J. S. Wiley, "Palladium as a lead finish for surface mounted integrated circuit packages," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 14, pp. 567-572, Sept. 1991.
2. A. Murata and D. C. Abbott, "Technical trends of leadframe surface finishing," in Tech. Proc. Semicon., Japan, 1990, pp. 415-26.
3. M. Kurihara, M. Mori, T. Uno, T. Tani, and T. Morikawa, "Characterization of palladium pre-plated leadframe in packaging process," in Proc. SEMI Packag. Sem., Taiwan, 1997, pp. 59-65.
4. R. Groover, "Ni/Pd preplated leadframes," presented at 9th Annu. Soldering Technol. Electron. Packag. Symp., Binghamton, NY, 1996.
5. Personal communication, Dec. 1998.
6. D. W. Romm and N. McLellan, "Evaluation of water soluble and noclean solder pastes with Sn/Pb and palladium plated IC devices," Surf. Mount Technol., pp. 35-0, Jan. 1993.
7. M. A. Kwoka and D. M. Foster, "Lead finish comparison of lead-free solders versus eutectic solder," presented at Surface Mount Int. Conf., San Jose, CA, 1994.
8. H. H. Manko, Solders and Soldering, 3rd ed. New York: McGraw-Hill, 1992, pp. 254-257.
9. W. H. Abbott, "The development and performance characteristics of mixed flow gas test environments," in Electrical Contacts - 1987, Proceedings of the Thirty-Third IEEE Holm Conference on Electrical Contacts. New York: IEEE, 1987, pp. 67-78.
10. D. Napp, "NCMS lead-free electronic interconnect program," presented at Surface Mount Int. Conf., San Jose, CA, 1994.