Effects of dimple and metal coating on interfacial adhesion in plastic packages

Journal of Electronic Materials

Volumn 32, Issue 6, 2003, Pages 564-573

  Lebbai, M ^a   Kim, Jang Kyo ^a   Yuen, Matthew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Interfacial adhesion; Lead frame; Metal coatings; Plastic packages; Surface energy

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); COATINGS; COMPOSITION; COMPOSITION EFFECTS; ETCHING; FRACTURE; INTERFACIAL ENERGY; PLASTICS APPLICATIONS; SURFACE ROUGHNESS; WETTING;

ELEMENTAL ANLAYSIS; INTERFACIAL ADHESION; MECHANICAL INTERLOCKING; METALLIC COATINGS; SILICON CONTENT; SURFACE CHARACTERISTICS; WETTABILITY;

COPPER ALLOYS;

EID: 0038498828     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0143-x     Document Type: Article

References (22)

1. L.T. Nguyen, ASME J. Electron. Packaging 115, 346 (1993).
2. I. Fukuzawa, S. Ishiguro, and S. Nanbu, Int. Reliability Physics Symp. (Piscataway, NJ: IEEE, 1985), pp. 192-197.
3. S. Kuroki and K. Oota, 39th Electronic Components Technology Conf. (Piscataway, NJ: IEEE, 1989), pp. 885-890.
4. N. Mogi and H. Yasuda, 42nd Electronic Components Technology Conf. (Piscataway, NJ: IEEE, 1992), pp. 1023-1029.
5. S. Asai, U. Satura, and M. Tobita, J. Appl. Polym. Sci. 51, 1945 (1994).
6. T. Nishioka, M. Nagasawa, K. Igarshi, M. Kohmoto, and S. Ito, 40th Electronic Components Technology Conf. (Piscataway, NJ: IEEE, 1990), pp. 625-631.
7. T.O. Steiner and D. Suhl, IEEE Trans. Comp. Hybrids Manuf. Technol. 10, 209 (1987).
8. R. Lin, E. Blackshear, G. May, G. Hamilton, and D. Kirby, 7th Ann. Conf. of International Electronic Packaging Society (1988), pp. 995-1010.
9. L.T. Nguyen and M. Michael, 42nd Electronic Components Technology Conf. (Piscataway, NJ: IEEE, 1992), pp. 930-938.
10. S. Altimari, S. Golwalkar, P. Boysan, and R. Foehringer, 42nd Electronic Components Technology Conf. (Piscataway, NJ: IEEE, 1992), pp. 945-950.
11. O. Yoshioka, N. Okabe, S. Nagayana, G. Murakami, and R. Yamagishi, 39th Electronic Components Technology Conf. (Piscataway, NJ: IEEE, 1989), pp. 464-471.
12. S. Kim, IEEE Trans. Comp. Hybrids Manuf. Technol. 14, 809 (1991).
13. S. Yi, C.Y. Yue, H. Hsieh, L. Fong, and S.K. Lahiri, J. Adhes. Sci. Technol. 13, 789 (1999).
14. S. Yi, J.K. Kim, C.Y. Yue, and J.H. Hsieh, J. Adhes. 73, 1 (2000).
15. D.C. Abbott, R.M. Brook, N. McLelland, and J.S. Wiley, IEEE Trans. Comp. Hybrids Manuf. Technol. 14, 567 (1991).
16. S. Wu, J. Adhes. 5, 39 (1973).
17. J. Guzek, H. Azimi, and S. Suresh, IEEE Trans. Comp. Packaging Manuf. Technol. Part A 20, 496 (1997).
18. G.S. Ganesan, G.L. Lewis, and H.M. Berg, Adv. Electron. Packaging ASME 10, 450 (1995).
19. S.J. Cho, K.W. Paik, and Y.G. Kim, IEEE Trans. Comp. Packaging Manuf. Technol. Part B 20, 167 (1997).
20. C.T. Chong, A. Leslie, L.T. Beng, and C. Lee, 45th Electronic Components Technology Conf. (Piscataway, NJ: IEEE, 1995), pp. 463-469.
21. H. Ohsuga, H. Suzuki, T. Aihara, and T. Hamano, 44th Electronic Components Technology Conf. (Piscataway, NJ: IEEE, 1994), pp. 141-146.
22. K.C. Chan, T.C. Chai, Y.Z. Yang, and R. Gopalakrishnan, 50th Electronic Components Technology Conf. (Piscataway, NJ: IEEE, 2000), pp. 175-182.