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Volumn 89, Issue 13, 2006, Pages
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In situ formation of Cu-Sn-Ni intermetallic nanolayer as a diffusion barrier in preplated lead frames
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER ALLOYS;
CORROSION PROTECTION;
DIFFUSION;
ELECTROPLATING;
LEAD PLATING;
OXIDATION;
3SN;
DIFFUSE REACTIONS;
DIFFUSION BARRIERS;
THICK EPITAXYLIKES;
INTERMETALLICS;
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EID: 33749240914
PISSN: 00036951
EISSN: None
Source Type: Journal
DOI: 10.1063/1.2352803 Document Type: Article |
Times cited : (12)
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References (16)
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