메뉴 건너뛰기




Volumn 89, Issue 13, 2006, Pages

In situ formation of Cu-Sn-Ni intermetallic nanolayer as a diffusion barrier in preplated lead frames

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; CORROSION PROTECTION; DIFFUSION; ELECTROPLATING; LEAD PLATING; OXIDATION;

EID: 33749240914     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2352803     Document Type: Article
Times cited : (12)

References (16)
  • 12
    • 0000985924 scopus 로고
    • edited by T. B. Massalski ASM International, Materials Park, OH
    • P. Nash and A. Nash, in Alloy Phase Diagrams, edited by T. B. Massalski (ASM International, Materials Park, OH, 1991), Vol. 21, p. 2318.
    • (1991) Alloy Phase Diagrams , vol.21 , pp. 2318
    • Nash, P.1    Nash, A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.