Fracture behaviors of nanowire-coated metal/polymer systems under mode-I loading condition

Acta Materialia

Volumn 52, Issue 20, 2004, Pages 5815-5828

  Lee, Ho Young ^a   Kim, Yong Hyup ^a   Chang, Young Keun ^b  

^a Seoul National University   (South Korea)

^b Hankuk Aviation University   (South Korea)

Author keywords

Copper alloys; Failure path; Fiber reinforced composite; Micromechanical modeling; Nanostructure; Polymer

Indexed keywords

ADHESION; FRACTURE; FRACTURE TOUGHNESS; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

ADHESION STRENGTH; FAILURE PATHS; MICROMECHANICAL MODELING;

NANOSTRUCTURED MATERIALS;

EID: 7444249076     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2004.08.040     Document Type: Article

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