Sn whisker growth during thermal cycling

Acta Materialia

Volumn 59, Issue 19, 2011, Pages 7255-7267

  Suganuma, Katsuaki ^a   Baated, Alongheng ^a   Kim, Keun Soo ^a   Hamasaki, Kyoko ^a   Nemoto, Norio ^b   Nakagawa, Tsuyoshi ^c   Yamada, Toshiyuki ^d  

^a OSAKA UNIVERSITY   (Japan)

^b JAPAN AEROSPACE EXPLORATION AGENCY   (Japan)

^c Nippon Avionics Co Ltd   (Japan)

^d Avionics Fukushima Co Ltd   (Japan)

Author keywords

Grain boundaries; Oxidation; Thermal cycling; Tin; Whisker

Indexed keywords

CERAMIC CHIPS; DEEP GROOVE; IN-VACUUM; PURE SN; SN PLATING; SN WHISKER; THERMAL CYCLE; WHISKER; WHISKER DENSITY; WHISKER GROWTH;

GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; OXIDATION; THERMAL CYCLING; TIN; VACUUM;

GRAIN GROWTH;

EID: 80053176261     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2011.08.017     Document Type: Article

References (29)

1. K.N. Tu, and J.C.M. Li Mater Sci Eng A 409 2005 131
2. J.W. Osenbach, R.L. Shook, B.T. Vaccaro, B.D. Potteiger, A.N. Amin, and K.N. Hooghan IEEE Trans Electron Pack Manuf 28 2005 36
3. B.Z. Lee, and D.N. Lee Acta Mater 46 1998 3701
4. W.J. Boetinger, C.E. Johnson, L.A. Bendersky, K.W. Moon, M.E. Williams, and G.R. Stafford Acta Mater 53 2005 5033
5. T. Kato, H. Akahoshi, M. Nakamura, T. Terasaki, T. Iwasaki, and T. Hashimoto IEEE Trans Electron Pack Manuf 33 2010 165
6. Terasaki T, Iwasaki T, Okura Y, Suzuki T, Kato T, Nakamura M, et al. In: 59th Electronic components and technology conference (ECTC 2009); 2009. p. 277-84.
7. Dittes M, Oberndorff P, Crema P, Schroeder V. In: Proc 5th conference on electronics packaging technology (EPTC 2003); 2003. p. 183-8.
8. Shin JW, Chason E. J Mater Res 2009; 24: 1522.
9. J. Jiang, J.E. Lee, K.S. Kim, and K. Suganuma J Alloys Compd 462 2008 244
10. A. Baated, K.S. Kim, K. Suganuma, S. Huang, B. Jurcik, and S. Nozawa J Mater Sci Mater Electron 21 2010 1066
11. J.W. Osenbach, J.M. DeLucca, B.D. Potteiger, A. Amin, R.L. Shook, and F.A. Baiocchi IEEE Trans Electron Pack Manuf 30 2007 23
12. R.M. Fisher, L.S. Darken, and K.G. Carroll Acta Metal 2 1954 368
13. S.K. Lin, Y. Yorikado, J. Jiang, K.S. Kim, K. Suganuma, and S.W. Chen J Mater Res 22 2007 1975
14. T. Shibutani, Q. Yu, T. Yamashita, and M. Shiratori IEEE Trans Electron Pack Manuf 29 2006 259
15. S.H. Liu, C. Chen, P.C. Liu, and T. Chou J Appl Phys 95 2004 7742
16. C.C. Wei, P.C. Liu, C. Chen, and K.N. Tu J Mater Res 23 2008 2017
17. M. Takeuchi, K. Kamiyama, and K. Suganuma J Electron Mater 35 2006 1918
18. Kim KS, Hamasaki K, Lee K, Baated A, Suganuma K, Tsujimoto M. In: Proc 19th micro electronics symposium, Fukuoka, Japan; 2009. p. 65
19. K.W. Moon, C.E. Johnson, M.E. Williams, O. Kongstein, G.R. Stafford, and C.R. Handwerker J Electron Mater 34 2005 L31
20. For example, see the NASA Tin Whisker. < http://nepp.nasa.gov/whisker/ >.
21. M. Terauchi, F. Satou, H. Sugizaki, and K. Suganuma J Electron Microsc 60 2011 25
22. J.E. Breen, and J. Weertman Trans AIME 203 1955 1230
23. F.A. Mohamed, K.L. Murty, and J.W. Morris Metal Trans 4 1973 935
24. D. Mitlin, C.H. Raeder, and R.W. Messler Jr. Metal Mater Trans A 30A 1999 115
25. C. Basaran, and R. Chandaroy J Electron Pack 124 2002 60
26. M.D. Mathew, H. Yang, S. Movva, and K.L. Murty Metal Mater Trans A 36A 2005 99
27. H.L. Cobb Month Rev Am Electroplat Soc 33 1946 28
28. A. Baated, K.-S. Kim, and K. Suganuma J Mater Sci: Mater Electron 2011 22 10.1007/s10854-011-0346-5
29. A. Skwareka, M. Pluskab, J. Ratajczakb, A. Czerwinskib, K. Witeka, and D. Szwagierczaka Mater Sci Eng B 176 2011 352