Evaluation of tin-whisker growth during thermal-cycle testing using stress- and mass-diffusion analysis

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 277-284

  Terasaki, Takeshi ^a   Iwasaki, Tomio ^a   Okura, Yasutaka ^a   Suzuki, Tomohisa ^a   Kato, Takahiko ^a   Nakamura, Masato ^a   Hashimoto, Tomoaki ^b  

^a HITACHI LTD   (Japan)

^b RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC DENSITY; CYCLE TESTING; DENSITY DISTRIBUTIONS; DIFFUSION ANALYSIS; DIFFUSION COEFFICIENTS; EXPANSION ANISOTROPY; FEM MODELS; GRAIN-BOUNDARY DIFFUSION; MD SIMULATION; MOLECULAR DYNAMICS SIMULATIONS; ORIENTATION DISTRIBUTIONS; POLYCRYSTALLINE; SIMULATION TECHNIQUE; STRESS GRADIENT; STRESS-INDUCED DIFFUSION; THERMAL CYCLING TEST; TIN COATING; TIN WHISKER; WHISKER DENSITY; WHISKER GROWTH; XRD MEASUREMENTS;

ANISOTROPY; CRYSTAL WHISKERS; DIFFUSION; DIFFUSION COATINGS; FINITE ELEMENT METHOD; SIMULATORS; STRESS ANALYSIS; THERMAL EXPANSION; TIN; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

CRYSTAL ORIENTATION;

EID: 70349658303     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074028     Document Type: Conference Paper

References (10)

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