Sn whiskers: Material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 28, Issue 1, 2005, Pages 36-62

  Osenbach, John W ^a   Shook, Richard L ^a   Vaccaro, Brian T ^a   Potteiger, Brian D ^a   Amin, Ahmed N ^a   Hooghan, K N ^a   Suratkar, P ^b   Ruengsinsub, P ^b  

^a AGERE SYSTEMS   (United States)

^b Agere Systems   (Thailand)

Author keywords

Lead free; Reliability; Sn whiskers

Indexed keywords

ANNEALING; COPPER; CRYSTAL GROWTH; ELECTRON DEVICES; LEAD; NUCLEATION; PLATING; RELIABILITY; SCANNING ELECTRON MICROSCOPY; THERMAL CYCLING; THICK FILMS; TIN;

COPPER LEAD FRAMES; TIN WHISKERS;

CRYSTAL WHISKERS;

EID: 20344380688     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.847438     Document Type: Article

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