Correlation between whisker initiation and compressive stress in electrodeposited tin-copper coating on copper leadframes

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 33, Issue 3, 2010, Pages 165-176

  Kato, Takahiko ^a,b   Akahoshi, Haruo ^a   Nakamura, Masato ^a   Terasaki, Takeshi ^a   Iwasaki, Tomio ^a   Hashimoto, Tomoaki ^c   Nishimura, Asao ^d  

^a HITACHI LTD   (Japan)

^b HOKKAIDO UNIVERSITY   (Japan)

^c RENESAS TECHNOLOGY CORP   (Japan)

^d Jisso Partners Inc   (Japan)

Author keywords

Compressive stress gradient; coppertin inter metallic compound; diffusion along grain boundary (GB); electrodeposited tincopper coating; electron microscopy; electron backscatter diffraction pattern (EBSP) measurement; field emission scanning transmission electron microscopy (FE STEM); field emission transmission electron microscopy (FE TEM); finite element analysis (FEA); molecular dynamics; planar slicing; stress distribution; tin diffusion; whisker root; whisker initiation site

Indexed keywords

COPPERTIN INTER METALLIC COMPOUND; FIELD-EMISSION TRANSMISSION ELECTRON MICROSCOPIES; FINITE ELEMENT ANALYSIS; INITIATION SITES; PLANAR SLICING; STRESS DISTRIBUTION; STRESS GRADIENT; TIN-COPPER; WHISKER ROOT;

ATOMS; BACKSCATTERING; COMPRESSIVE STRESS; COPPER; DIFFRACTION; DIFFUSION; ELECTRODEPOSITION; ELECTRON EMISSION; ELECTRONS; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MEASUREMENT THEORY; METALLIC COMPOUNDS; MOLECULAR DYNAMICS; STRESS CONCENTRATION; SURFACES; TENSILE STRESS; TIN; TITANIUM COMPOUNDS; TRANSMISSION ELECTRON MICROSCOPY;

DIFFUSION COATINGS;

EID: 77955717653     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2010.2045384     Document Type: Conference Paper

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