Stress behavior of electroplated Sn films during thermal cycling

Journal of Materials Research

Volumn 24, Issue 4, 2009, Pages 1522-1528

  Shin, Jae Wook ^a   Chason, Eric ^a  

^a BROWN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BULK MATERIALS; INDUCED STRAINS; MECHANICAL BEHAVIORS; POWER-LAW CREEPS; STRESS BEHAVIORS; SURFACE OXIDES; THERMAL CYCLES; THICKNESS DEPENDENCES; WHISKER FORMATIONS;

RESIDUAL STRESSES; STRESS RELAXATION; SURFACE DIFFUSION; THERMAL CYCLING; THERMAL EXPANSION; TIN;

SURFACE RELAXATION;

EID: 65349092310     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2009.0172     Document Type: Article

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