Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging

Journal of Materials Research

Volumn 22, Issue 7, 2007, Pages 1975-1986

  Lin, Shih Kang ^a,b   Yorikado, Yuhi ^b   Jiang, Junxiang ^b   Kim, Keun Soo ^b   Suganuma, Katsuaki ^b   Chen, Sinn Wen ^a   Tsujimoto, Masanobu ^c   Yanada, Isamu ^c  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b OSAKA UNIVERSITY   (Japan)

^c Central Research and Development Laboratory   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATED FILM; GRAIN MORPHOLOGY; GRAIN ORIENTATION; WHISKER GROWTH;

COMPRESSIVE STRESS; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; CRYSTAL WHISKERS; DEFORMATION; ELECTROPLATING; MORPHOLOGY; SUBSTRATES; THIN FILMS; TIN;

ELECTRONICS PACKAGING;

EID: 34547120976     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2007.0232     Document Type: Article

References (21)

1. C.A. Harper: Electronic Packaging and Interconnection Handbook, 3rd ed. (McGraw-Hill, New York, 2000).
2. C.F. Coombs, Jr.: Printed Circuits Handbook, 5th ed. (McGraw-Hill, New York, 2001).
3. A. Nathan and B.R. Chalamala: Special issue on flexible electronics technology, part I: Systems and applications. Proc. IEEE 93, 1235 (2005).
4. A. Nathan and B. R. Chalamala: Flexible electronics technology, Part II: Materials and devices. Proc. IEEE 93, 1391 (2005).
5. G.T. Galyon: Annotated tin whisker bibliography and anthology. IEEE Trans. Electron. Packag. Manuf. 28, 94 (2005).
6. W.J. Choi, G. Galyon, K.N. Tu, and T.Y. Lee: The structure and kinetics of tin-whisker formation and growth on high tin content finishes, in Handbook of Lead-free Solder Technology for Microelectronic Assemblies, edited by K.J. Puttlitz and K.A. Stalter (Marcel Dekker, Basel, New York, 2004), pp. 851-914.
7. B-Z. Lee and D.N. Lee: Spontaneous growth mechanism of tin whiskers. Acta Mater. 46, 3701 (1998).
8. M. Dittes, P. Oberndorff, P. Crema, and P. Su: Tin whisker formation - A stress relieve phenomenon, in Stress-induced Phenomenon in Metallization, AIP Conference Proceedings, Vol. 817 (American Institute of Physics, Melville, NY, 2006), pp. 348-359.
9. K.N. Tu, J.O. Suh, and A.T. Wu: Tin whisker growth on lead-free solder finishes, in Lead Free Solder, edited by D. Shangguan (ASM International, Materials Park, OH, 2005), pp. 147-163.
10. W.J. Boettinger, C.E. Johnson, L.A. Bendersky, K-W. Moon, M.E. Williams, and G.R. Stafford: Whisker and hillock formation on Sn, Sn-Cu, and Sn-Pb electrodeposits. Acta Mater. 53, 5033 (2005).
11. K.N. Tu and J.C.M. Li: Spontaneous whisker growth on lead-free solder finishes. Mater. Sci. Eng., A 409, 131 (2005).
12. P. Su, M. Ding, and S. Chopin: Effects of reflow on the microstructure and whisker growth propensity of Sn finish, in Proceedings of Electronic Components and Technology Conference, (IEEE, Piscataway, NJ, 2005), pp. 434-440.
13. W. Zhang and F. Schwager: Effects of lead on tin whisker elimination - Efforts toward lead-free and whisker-free electrodeposition of tin. J. Electrochem. Soc. 153, C337 (2006).
14. K-S. Kim, C-H. Yu, and J-M. Yang: Behavior of tin whisker formation and growth on lead-free solder finish. Thin Sold Films 504, 350 (2006).
15. K-S. Kim, C-H. Yu, and J-M. Yang: The tin whisker formation of lead-free plated leadframes. Microelectron. Reliab. 46, 1080 (2006).
16. K-S. Kim, T. Matsuura, and K. Suganuma: Effect of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems. J. Electron. Mater. 35, 41 (2006).
17. R.M. Fisher, L.S. Darken, and K.G. Carroll: Accelerated growth of tin whiskers. Acta Metall. 2, 368 (1954).
18. C.H. Pitt and R.G. Henning: Pressure-induced growth of metal whiskers. J. Appl. Phys. 35, 459 (1964).
19. T. Teshigawara, T. Nakata, K. Inoue, and T. Watanabe: Microstructure of pure tin electrodeposited films. Scripta Mater. 44, 2285 (2001).
20. S-K. Lin, Y. Yorikado, J-X. Jiang, K-S. Kim, K. Suganuma, S-W. Chen, M. Tsujimoto, and I. Yanada: Microstructure development of mechanical deformation-induced Sn whiskers. J. Electron. Mater. (2007, in press).
21. K.N. Tu, J.W. Mayer, and L.C. Fieldman: Electronic Thin Film Science: For Electrical Engineering and Materials Scientist, 1st ed. (Prentice Hall College Division, New York, 1996), p. 89.