Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes

Journal of Materials Research

Volumn 23, Issue 7, 2008, Pages 2017-2022

  Wei, C C ^a   Liu, P C ^a   Chen, Chih ^a   Tu, K N ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; LEAD; METALLIZING;

SN WHISKERS; SN-PB SOLDER;

TIN;

EID: 48749095902     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2008.0253     Document Type: Article

References (20)

1. K.N. Tu and J.C.M. Li: Spontaneous whisker growth on lead-free solder finishes. Mater. Sci. Eng., A 409, 131 (2005).
2. nepp.nasa.gov/whisker/ (accessed May 2007)
3. S.M. Arnold: Repressing the growth of tin whiskers. Plating Mag. 53, 96 (1966).
4. U. Lindborg: Observations on the growth of whisker crystals from zinc electroplate. Metall. Trans. A 6, 1581 (1975).
5. B.Z. Lee and D.N. Lee: Spontaneous growth mechanism of tin whiskers. Acta Mater. 46, 3701 (1998).
6. W.J. Choi, T.Y. Lee, K.N. Tu, N. Tamura, R.S. Celestre, A.A. MacDowell, Y.Y. Bong, and L. Nguyen: Tin whiskers studied by synchrotron radiation scanning x-ray micro-diffraction. Acta Mater. 51, 6253 (2003).
7. P. Konrad, C. Bacca, E. Scheer, P. Brenner, A. Mayer-Gindner, and H. v. Löhneysen: Stable single-atom contacts of zinc whiskers. Appl. Phys. Lett. 86, 213115 (2005).
8. G.K. Wehner: Whisker growth and cone formation on metal surfaces under ion bombardment. Appl. Phys. Lett. 43, 366 (1983).
9. K.N. Tu: Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions. Phys. Rev. B 49, 2030 (1994).
10. M.W. Barsoum, E.N. Hoffman, R.D. Doherty, S. Gupta, and A. Zavaliangos: Driving force and mechanism for spontaneous metal whisker formation. Phys. Rev. Lett. 93, 206104 (2004).
11. S.H. Liu, C. Chen, P.C. Liu, and T. Chou: Tin whisker growth driven by electrical currents. J. Appl. Phys. 95, 7742 (2004).
12. Y.W. Lin, Y-S. Lai, Y.L. Lin, C.T. Tu, and C.R. Kao: Tin whisker growth induced by high electron current density. J. Electron. Mater. 37, 17 (2008).
13. C.C. Wei and C. Chen: Critical length of electromigration for eutectic SnPb solder stripe. Appl. Phys. Lett. 88, 182105 (2006).
14. I.A. Blech and C. Herring: Stress generation by electromigration. Appl. Phys. Lett. 29, 131 (1976).
15. C.K. Chou, Y.C. Hsu, and C. Chen: Electromigration in eutectic SnPb solder stripes. J. Electron. Mater. 35, 1655 (2006).
16. A.T. Huang, A.M. Gusak, and K.N. Tu: Thermomigration in SnPb composite flip chip solder joints. Appl. Phys. Lett. 88, 141911 (2006).
17. H.Y. Hsiao and C. Chen: Thermomigration in flip-chip SnPb solder joints under alternating current stressing. Appl. Phys. Lett. 90, 152105 (2007).
18. K. Chen and G.D. Wilcox: Observations of the spontaneous growth of tin whiskers on tin-manganese alloy electrodeposits. Phys. Rev. Lett. 94, 066104 (2005).
19. P.C. Wang, G.S. Cargill III, I.C. Noyan, and C.K. Hu: Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction. Appl. Phys. Lett. 72, 1296 (1998).
20. C.Y. Liu, C. Chen, C.N. Liao, and K.N. Tu: Microstructure-electromigration correlation in a thin strips of eutectic SnPb solder stressed between Cu electrodes. Appl. Phys. Lett. 75, 58 (1999).