SCOPUS 정보 검색 플랫폼

Volumn 176, Issue 4, 2011, Pages 352-357

Analysis of tin whisker growth on lead-free alloys with Ni presence under thermal shock stress

Author keywords

Lead free alloys; Ni doping effect; Ni sublayer; Thermal shocks; Tin whiskers

Indexed keywords

BINARY ALLOYS; COPPER; CRYSTAL WHISKERS; LEAD ALLOYS; NICKEL; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; TIN; TIN ALLOYS;

CU LAYERS; DOPING EFFECTS; LEAD-FREE ALLOY; NI DOPING EFFECT; NI SUBLAYER; NI-DOPING; SUB-LAYERS; TIN WHISKER; WHISKER FORMATION; WHISKER GROWTH;

THERMAL SHOCK;

EID: 79951854394 PISSN: 09215107 EISSN: None Source Type: Journal
DOI: 10.1016/j.mseb.2010.10.001 Document Type: Article

Times cited : (19)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.