SCOPUS 정보 검색 플랫폼

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 183-188

Tin whisker formation in thermal cycling conditions

(4) Dittes, M a Oberndorff, P b Crema, P c Schroeder, V d

a INFINEON TECHNOLOGIES AG (Germany)

b PHILIPS RESEARCH LABORATORIES (Germany)

c STMICROELECTRONICS (Italy)

d HEWLETT PACKARD COMPANY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL WHISKERS; ELECTRONIC EQUIPMENT; ELECTRONICS PACKAGING; OSCILLATORS (ELECTRONIC);

ENVIRONMENTAL CONDITIONS; LINEAR RELATIONSHIPS; NUMBER OF CYCLES; SECOND LEVEL; TEMPERATURE CYCLING; THERMAL MISMATCH; WHISKER FORMATION; WHISKER GROWTH;

TIN;

EID: 84925538323 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/EPTC.2003.1271513 Document Type: Conference Paper

Times cited : (31)

References (8)

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2
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3
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- Where Crystal Planes Meet: Contribution to the Understanding of the Tin Whisker Growth Process
- New Orleans, S-08-03-01
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- IPC Annual Conference Nov. 2002
- Egli, A.¹

4
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- Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish
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- Choi, W.J.¹

5
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- Effects of Conformal Coat on Tin Whisker Growth
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6
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- Tin Whisker Formation - Results, Test Methods and Countermeasures
- New Orleans
- Dittes, M; Oberndorff, P; Petit, L; "Tin Whisker Formation - Results, Test Methods and Countermeasures" Proc. 53. Electronic Components & Technology Conference (ECTC), New Orleans, 2003, pp. 822-826
- (2003) Proc. 53. Electronic Components & Technology Conference (ECTC) , pp. 822-826
- Dittes, M.¹ Oberndorff, P.² Petit, L.³

7
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- Tin Whiskers on Lead-free Platings
- August Singapore
- Oberndorff, P; Dittes, M; Petit, L; Chen, C.C; Kluizenaar, E.E. de "Tin Whiskers on Lead-free Platings" Proc. SEMI Technology Symposium, Advanced Packaging Technologies II, August 2003, Singapore, pp 51-55
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8
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- Intermetallic Formation in Relation to Tin Whiskers
- June 11-12, Brussels, Belgium
- Oberndorff, P; Dittes, M; Petit, L; "Intermetallic Formation in Relation to Tin Whiskers" Proc. IPC/Soldertec International Conference on Lead-free Electronics - Towards Implementation of the RHS Directive, June 11-12, 2003, Brussels, Belgium, pp 170-178
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.