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Volumn 60, Issue 1, 2011, Pages 25-27

Development of a cryogenic stage for an ion-milling instrument

Author keywords

cooling stage; ion milling; Sn plating

Indexed keywords

COPPER; ION; TIN;

EID: 79951617060     PISSN: 00220744     EISSN: 14779986     Source Type: Journal    
DOI: 10.1093/jmicro/dfq069     Document Type: Article
Times cited : (3)

References (3)
  • 1
    • 0032083872 scopus 로고    scopus 로고
    • Spontaneous growth mechanism of tin whiskers
    • PII S1359645498000457
    • Lee B Z and Lee D N (1998) Spontaneous growth mechanism of tin whiskers. Acta Mater. 46:3701-3714. (Pubitemid 128427564)
    • (1998) Acta Materialia , vol.46 , Issue.10 , pp. 3701-3714
    • Lee, B.-Z.1    Lee, D.N.2
  • 2
    • 26844565117 scopus 로고    scopus 로고
    • Whisker and Hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits
    • DOI 10.1016/j.actamat.2005.07.016, PII S1359645405004283
    • Boettinger W J, Johnson C E, Bendersky L A, Moon K W, Williams M E, and Stafford G R (2005) Whisker and Hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits. Acta Mater. 53:5033-5050. (Pubitemid 41444250)
    • (2005) Acta Materialia , vol.53 , Issue.19 , pp. 5033-5050
    • Boettinger, W.J.1    Johnson, C.E.2    Bendersky, L.A.3    Moon, K.-W.4    Williams, M.E.5    Stafford, G.R.6
  • 3
    • 19944432174 scopus 로고    scopus 로고
    • Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
    • Zeng K, Stierman R, Chiu T C, and Edwards D (2005) Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability. J. Appl. Phys. 97:024508-1-8.
    • (2005) J. Appl. Phys. , vol.97 , pp. 0245081-0245088
    • Zeng, K.1    Stierman, R.2    Chiu, T.C.3    Edwards, D.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.