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Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 10, 2010, Pages 1066-1075

Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders

(7) Baated, Alongheng a Kim, Keun Soo a Suganuma, Katsuaki a Huang, Sharon b Jurcik, Benjamin b Nozawa, Shigeyoshi b Ueshima, Minoru c

a OSAKA UNIVERSITY (Japan)

b AIR LIQUIDE (France)

c SENJU METAL INDUSTRY CO LTD (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AIR ATMOSPHERE; HALOGEN CONTENTS; LEAD FRAME; OXIDE FORMATION; QUAD FLAT PACKAGE; RELATIVE HUMIDITIES; SN WHISKER; SNAGCU SOLDER; WHISKER FORMATION; WHISKER GROWTH;

ATMOSPHERIC HUMIDITY; COPPER ALLOYS; CRYSTAL WHISKERS; HALOGEN ELEMENTS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 77957909704 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-010-0099-6 Document Type: Article

Times cited : (24)

References (9)

1
- 0009704234
- Filamentary growths on metal surfaces-whisker
- KG Compton A Mendizza SM Arnold 1951 Filamentary growths on metal surfaces-whisker Corrosion 7 10 327 334
- (1951) Corrosion , vol.7 , Issue.10 , pp. 327-334
- Compton, K.G.¹ Mendizza, A.² Arnold, S.M.³

2
- 33644917098
- A history of tin whisker theory: 1946 to 2004
- G.T. Galyon, in A history of tin whisker theory: 1946 to 2004, SMTAI International conference, Chicago (2004) ( http://www.nemi.org/projects/ese/tin- whikser-activities.html )
- (2004) SMTAI International Conference, Chicago
- Galyon, G.T.¹

3
- 1542343800
- The growth of metal whiskers on electrical components
- S.M. Arnold, in The growth of metal whiskers on electrical components, Proceedings of the IEEE electronic components conference, 1959, pp. 75-82
- (1959) Proceedings of the IEEE Electronic Components Conference , pp. 75-82
- Arnold, S.M.¹

4
- 0016921629
- A model for the spontaneous growth of zinc, cadmium and tin whiskers
- 1:CAS:528:DyaE28XksFCksrY%3D 10.1016/0001-6160(76)90021-3
- U Lindborg 1976 A model for the spontaneous growth of zinc, cadmium and tin whiskers Acta Metall. 24 2 181 186 1:CAS:528:DyaE28XksFCksrY%3D 10.1016/0001-6160(76)90021-3
- (1976) Acta Metall. , vol.24 , Issue.2 , pp. 181-186
- Lindborg, U.¹

5
- 0030288374
- Cu/Sn interfacial reactions: Thin-film case versus bulk case
- DOI 10.1016/S0254-0584(97)80016-8, PII S0254058496018019
- KN Tu 1996 Copper/tin interfacial reactions: thin-film case versus bulk case Mater. Chem. Phys 46 2-3 217 223 1:CAS:528:DyaK28XntVSmsLw%3D 10.1016/S0254-0584(97)80016-8 (Pubitemid 126364954)
- (1996) Materials Chemistry and Physics , vol.46 , Issue.2-3 , pp. 217-223
- Tu, K.N.¹

6
- 0016073268
- Spontaneous growth of whiskers on tin coatings. Twenty years of observation
- SC Britton 1974 Spontaneous growth of whiskers on tin coatings. Twenty years of observation Trans. Inst. Met. Finish. 52 95 102
- (1974) Trans. Inst. Met. Finish. , vol.52 , pp. 95-102
- Britton, S.C.¹

7
- 0032083872
- Spontaneous growth mechanism of tin whiskers
- 1:CAS:528:DyaK1cXktlWksbo%3D 10.1016/S1359-6454(98)00045-7
- B-Z LEE DN Lee 1998 Spontaneous growth mechanism of tin whiskers Acta Mater. 46 10 3701 3714 1:CAS:528:DyaK1cXktlWksbo%3D 10.1016/S1359-6454(98)00045- 7
- (1998) Acta Mater. , vol.46 , Issue.10 , pp. 3701-3714
- Lee, B.-Z.¹ Lee, D.N.²

8
- 34047137097
- Sn corrosion and its influence on whisker growth
- DOI 10.1109/TEPM.2006.890637
- JW Osenbach JM DeLucca BD Potterger A Amin RL Shook FA Baiocchi 2007 Sn corrosion and its influence on whisker growth IEEE Trans. Electron. Pachaging Manuf. 30 1 23 35 1:CAS:528:DC%2BD2sXktFCjtbs%3D 10.1109/TEPM.2006.890637 (Pubitemid 46523149)
- (2007) IEEE Transactions on Electronics Packaging Manufacturing , vol.30 , Issue.1 , pp. 23-35
- Osenbach, J.W.¹ DeLucca, J.M.² Potteiger, B.D.³ Amin, A.⁴ Shook, R.L.⁵ Baiocchi, F.A.⁶

9
- 77957893142
- T. Tsukui, in JEITA activity report of solder whisker growth, 2nd international symposium on tin whisker (2008)
- (2008) JEITA Activity Report of Solder Whisker Growth, 2nd International Symposium on Tin Whisker
- Tsukui, T.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.