Electroless Co-P for diffusion barrier in Pb-free soldering

Electrochimica Acta

Volumn 50, Issue 23 SPEC. ISS., 2005, Pages 4621-4625

  Magagnin, L ^a   Sirtori, V ^b   Seregni, S ^b   Origo, A ^b   Cavallotti, P L ^a  

^a POLITECNICO DI MILANO   (Italy)

^b Celestica Italia   (Italy)

Author keywords

Cobalt; Electroless; Intermetallics; Lead free solder; Nickel

Indexed keywords

ENTHALPY; INTERMETALLICS; MAGNETIC RECORDING; MELTING; METALLIZING; NICKEL; PIEZOELECTRIC TRANSDUCERS; STRENGTH OF MATERIALS;

DIFFUSION BARRIERS; ELECTROLESS; LEAD-FREE SOLDERS; MELTING TEMPERATURE;

COBALT ALLOYS;

EID: 23844524506     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2004.10.098     Document Type: Article

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