Investigation of electroless Co(W,P) thin film as the diffusion barrier of underbump metallurgy

Journal of the Electrochemical Society

Volumn 155, Issue 5, 2008, Pages

  Wu, W C ^a   Hsieh, Tsung Eong ^a   Pan, Hung Chun ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COBALT COMPOUNDS; DIFFUSION BARRIERS; METALLURGY; PH EFFECTS;

SACRIFICIAL BARRIER BEHAVIOR; UNDERBUMP METALLURGY;

THIN FILMS;

EID: 41849102437     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2885083     Document Type: Article

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