Eliminating the hysteresis effect for reactive sputtering processes

Applied Physics Letters

Volumn 86, Issue 16, 2005, Pages 1-3

  Nyberg, T ^a   Berg, S ^a   Helmersson, U ^b   Hartig, K ^c  

^a UPPSALA UNIVERSITY   (Sweden)

^b LINKÖPING UNIVERSITY   (Sweden)

^c Cardinal CG   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BERG MODEL; HYSTERESIS EFFECTS; REACTIVE SPUTTERING; SPUTTER EROSION;

ALUMINUM; ARGON; CAPACITANCE; COMPUTER SIMULATION; FEEDBACK CONTROL; MANOMETERS; MATHEMATICAL MODELS; SPUTTERING; STABILITY;

HYSTERESIS;

EID: 23144432463     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1906333     Document Type: Article

References (6)

1. I. Safi, Surf. Coat. Technol. 127, 203 (2000).
2. S. Berg, T. Nyberg, H.-O. Blom, and C. Nender, Handbook of Thin Film Process Technology (Institute of Physics Publishing, Bristol, UK, 1998).
3. S. Berg, H.-O. Blom, T. Larsson, C. Nender, J. Vac. Sci. Technol. A 5, 202 (1987).
4. S. Berg, T. Larsson, C. Nender, and H.-O. Blom, J. Appl. Phys. 63, 887 (1988).
5. T. Serikawa and A. Okamoto, Thin Solid Films 101, 1 (1983).
6. S. Berg and T. Nyberg, Patent No. WO 03006703A1 (2001).