Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni-Cr)/PI interfaces in flexible printed circuits

Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 7, 2011, Pages 790-796

  Noh, Bo In ^a   Yoon, Jeong Won ^a   Lee, Bo Young ^b   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

^b Hankuk Aviation University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION CHARACTERISTIC; ADHESION PROPERTIES; AFTER-HEAT TREATMENT; CHEMICAL BONDINGS; CHEMICAL FUNCTIONS; CHEMICAL INTERACTIONS; FLEXIBLE COPPER CLAD LAMINATE; FLEXIBLE PRINTED CIRCUIT; FRACTURE SURFACES; HEAT TREATMENT TEMPERATURE; HOLDING TIME; METAL LAYER; PEEL STRENGTH; PEEL TESTS; ROLL-TO-ROLL PROCESS; SEED LAYER;

ADHESION; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; BOND STRENGTH (MATERIALS); CHEMICAL BONDS; ELECTRONICS PACKAGING; FRACTURE; FUNCTIONAL GROUPS; HEAT TREATMENT; LAMINATES; PHOTOELECTRON SPECTROSCOPY; POLYIMIDES; PRINTED CIRCUITS; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; X RAY PHOTOELECTRON SPECTROSCOPY;

CHROMIUM;

EID: 80051672120     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-010-0213-9     Document Type: Article

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