메뉴 건너뛰기




Volumn 42, Issue 7, 2002, Pages 1091-1099

Low cost flex substrates for miniaturized electronic assemblies

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COPPER; ELECTRONIC EQUIPMENT MANUFACTURE; MULTILAYERS; POLYMERS; POWER CONVERTERS; PRINTED CIRCUIT BOARDS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THICK FILMS;

EID: 0036642155     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00061-6     Document Type: Article
Times cited : (32)

References (17)
  • 5
    • 0003250489 scopus 로고
    • Characterization and cure of dielectric and conducting polymer thick films
    • (1992) Polym Eng Sci , vol.32 , Issue.17
    • Prime, R.B.1
  • 12
    • 0005837693 scopus 로고    scopus 로고
    • Development of a packaging strategy for an ultra compact down converter using flex circuitry and flip chip technologies
    • Final Report. submitted for publication
    • Philips Lighting
  • 16
    • 0029540649 scopus 로고
    • Flexible solution to solderless surface mount
    • (1995) Adhes Age , vol.38 , Issue.13 , pp. 3
    • Egloff, R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.