Low cost flex substrates for miniaturized electronic assemblies

Microelectronics Reliability

Volumn 42, Issue 7, 2002, Pages 1091-1099

  Barlow, F ^a   Lostetter, A ^a   Elshabini, A ^a  

^a University of Arkansas   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COPPER; ELECTRONIC EQUIPMENT MANUFACTURE; MULTILAYERS; POLYMERS; POWER CONVERTERS; PRINTED CIRCUIT BOARDS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THICK FILMS;

FLEX CIRCUITRY; INTEGRATED POWER MODULES;

MICROELECTRONICS;

EID: 0036642155     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00061-6     Document Type: Article

References (17)

1. Circuit reinvention in power electronics and identification of prior work
2. Energy, environment, and advances in power electronics
3. SiC power diodes provide breakthrough performance for a wide range of applications
4. SMT + flex = maximum versatility and reliability
5. Characterization and cure of dielectric and conducting polymer thick films
6. Printing flexible interconnect
7. Copper polymer thick film for high density and multilayer interconnects
8. Polymer/conductive filler composites: Chosen properties and application
9. Stabilization of PTF resistors for surface mount
10. Multilayer interconnects for a high power packaging strategy
11. Development of a packaging strategy for an ultra compact down converter using flex circuitry and flip chip technologies
12. Integrated power modules (IPMs), a novel mcm approach to high power electronics design and packaging
13. High density power modules: A packaging strategy
14. Various methods of direct chip attachment to flexible circuitry
15. Flexible solution to solderless surface mount
16. Design considerations for a reliable low cost tape ball grid array package