Effect of surface roughness on the adhesion properties of Cu/Cr films on polyimide substrate treated by inductively coupled oxygen plasma

Surface and Coatings Technology

Volumn 200, Issue 7, 2005, Pages 2072-2079

  Kim, Soo Hong ^a   Na, Sun Woong ^a   Lee, N E ^a   Nam, Yun Woo ^b   Kim, Young Ho ^c  

^a Sungkyunkwan University   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

^c Hanyang University   (South Korea)

Author keywords

Adhesion; Chromium; Copper; Plasma surface treatment; Polyimide

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHROMIUM; COPPER; INDUCTIVELY COUPLED PLASMA; METALLIC FILMS; OXYGEN; POLYIMIDES; SUBSTRATES; SURFACE ROUGHNESS; SURFACE TREATMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

ADHESION PROPERTIES; CHROMIUM FILMS; COPPER FILMS; POLYIMIDE SUBSTRATE; SURFACE CHEMICAL MODIFICATION; SURFACE MORPHOLOGICAL ROUGHENING;

ADHESION;

COATING;

EID: 29244446786     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.05.021     Document Type: Article

References (31)

1. L. Torsi N. Coffi C. Di Franco L. Sabbatin P.G. Zambonin T. Bleve-Zacheo Solid-State Electron. 45 2001 1479
2. C.D. Dimitrakopoulos D.J. Mascaro IBM J. Res. Develop. 45 2001 11
3. Y. Strunskus M. Grunze in: M. Crosh K. Mittal (Eds.) Polyimides - Fundamentals and Applications 1994 Marcel Dekker New York 187
4. J. Lai Polymers for Electronic Applications 1989 CRC Press Boca Raton, FL
5. T.L. Manzione Plastic Packaging of Microelectronic Devices 1990 Van Nostrand Reinhold New York
6. N.J. Chou C.H. Tang J. Vac. Sci. Technol., A, Vac. Surf. Films 2 1984 751
7. P.S. Ho P.O. Hahn J.W. Bartha G.W. Rubloff F.K. LeGoues B.D. Silverman J. Vac. Sci. Technol., A, Vac. Surf. Films 3 1985 739
8. R. Haight R.C. White B.D. Silverman P.S. Ho J. Vac. Sci. Technol., A, Vac. Surf. Films 6 1988 2188
9. F.K. LeGoues B.D. Silverman P.S. Ho J. Vac. Sci. Technol., A, Vac. Surf. Films 6 1988 2200
10. F. Paupel C.H. Yang S.T. Chen P.S. Ho J. Appl. Phys. 65 1989 1911
11. Marta M.D. Ramos Vacuum 64 2002 255
12. R.F. Saraf J.M. Roldan T. Derderian IBM J. Res. Develop. 38 1994 441
13. N.J. Chou D.W. Dong J. Kim A.C. Liu J. Electrochem. Soc. 131 1984 2335
14. D.S. Dunn J.L. Grant J. Vac. Sci. Technol., A, Vac. Surf. Films 7 1989 253
15. M.C. Van der Leeden G. Frens Adv. Eng. Mater. 4 2002 280
16. J.E.E. Baglin IBM J. Res. Develop. 38 1994 413
17. R. Flitsch D.-Y. Shih J. Vac. Sci. Technol., A, Vac. Surf. Films 8 1990 2376
18. A.L. Ruoff E.J. Kramer C.-Y. Li IBM J. Res. Develop. 32 1988 626
19. A.M. Ektessabi S. Hakamata Thin Solid Films 377-378 2000 621
20. F.D. Egitto L.J. Matienzo IBM J. Res. Develop. 38 1994 423
21. E.M. Liston L. Martinu M.R. Wertheimer in: M. Strobel C.S. Lyons K.L. Mittal (Eds.), Plasma Surface Modification of Polymers: Relevance to Adhesion 1994 VSP, Utrecht The Netherlands
22. M. Naddaf C. Balasubramanian P.S. Alegaonkar V.N. Bhoraskar A.B. Mandle V. Ganeshan S.V. Bhoraskar Nucl. Instr. and Meth. B 222 2004 135
23. A.D. Katnani A. Knoll M.A. Mycek J. Adhes. Sci. Technol. 3 1989 441
24. K.-W. Lee V. Viehbeck IBM J. Res. Develop. 38 1994 457
25. F.D. Egitto L.J. Matienzo K.J. Blackwell A.R. Knoll J. Adhes. Sci. Technol. 8 1994 411
26. ASTM-D Standard Test Method for Peel Resistance of Adhesives (T-peel test) 1876
27. J.Y. Song Jin Yu Acta Mater. 50 2002 3985
28. J.F. Moulder W.F. Stickle P.E. Sobol K.D. Bomben Handbook of X-ray Photoelectron Spectroscopy 1992 Perkin-Elmer Corporation Eden Prairie, MN, U.S.A.
29. D. Briggs J.C. Riviére in: D. Briggs M.P. Seah (Eds.), Practical Surface Analysis vol. 1 1983 John Wiley and Sons New York, U.S.A 136
30. D. Briggs ibid, pp. 443
31. J.H. Cross M.W. LeMay D.J. McClure J. Vac. Sci. Technol., A, Vac. Surf. Films 3 1985 495