Effects of heat treatment at 350 °C on the adhesion of Cu-Cr alloy films to polyimide

Journal of Materials Science

Volumn 35, Issue 8, 2000, Pages 1949-1955

  Ahn, E C ^a   Yu, Jin ^b   Park, I S ^c  

^a SAMSUNG Electronics   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^c Hynix Semiconductor Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); BRITTLE FRACTURE; COPPER ALLOYS; HEAT TREATMENT; INTERFACES (MATERIALS); PEELING; PLASTIC FILMS; POLYIMIDES; SPUTTER DEPOSITION; THERMAL EFFECTS; X RAY PHOTOELECTRON SPECTROSCOPY;

PEEL STRENGTH;

METALLIC FILMS;

EID: 0033891572     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004770519874     Document Type: Article

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