Plasma surface treatment of polyimide for adhesive Cu/80Ni20Cr/PI flexible copper clad laminate

Thin Solid Films

Volumn 516, Issue 14, 2008, Pages 4530-4534

  Eom, Jun Sun ^a   Kim, Sang Ho ^a  

^a Korea University of Technology and Education   (South Korea)

Author keywords

Adhesion; Atmospheric plasma treatment; FCCL; Low pressure plasma treatment; Polyimide; RF magnetron sputtering

Indexed keywords

ADHESION; AGING OF MATERIALS; CONTACT ANGLE; MAGNETRON SPUTTERING;

ATMOSPHERIC PLASMA TREATMENT; LOW PRESSURE PLASMA TREATMENT; MECHANICAL ROUGHNESS;

POLYIMIDES;

EID: 43049100343     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.01.022     Document Type: Article

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