Interfacial fracture energy measurements in the Cu/Cr/polyimide system

Materials Science and Engineering: A

Volumn 266, Issue 1-2, 1999, Pages 261-266

  Park, Y B ^a   Park, I S ^b   Yu, Jin ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

Cu film; Interfacial fracture energy; Peel test; Polyimide; X ray analysis

Indexed keywords

ADHESION; CHROMIUM; COPPER; METALLIC FILMS; POLYIMIDES; X RAY ANALYSIS;

COPPER FILM; PEEL TEST;

INTERFACIAL ENERGY;

EID: 0001244685     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(98)01117-4     Document Type: Article

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