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Journal of Adhesion Science and Technology

Volumn 12, Issue 1, 1998, Pages 95-104

Tantalum, tantalum nitride, and chromium adhesion to polyimide: Effect of annealing ambient on adhesion

(2) Buchwalter, L P a,c Holloway, K b

a IBM T J WATSON RESEARCH CENTER (United States)

b IBM MICROELECTRONICS (United States)

c NONE (United States)

Author keywords

Annealing; Metal adhesion; Polyimide

Indexed keywords

AMORPHOUS PHASIS; BIPHENYLENE; FORMING GAS; INTERFACE PREPARATION; METAL ADHESION; PEEL ADHESION; TANTALUM NITRIDES; TETRACARBOXYLIC ACID; THERMAL CYCLE;

ANNEALING; CHROMIUM; COPPER; NITRIDES; POLYIMIDES; TANTALUM; TANTALUM COMPOUNDS; THERMAL CYCLING; CARBOXYLIC ACIDS; INTERFACES (MATERIALS); REACTIVE ION ETCHING;

ADHESION;

PEEL ADHESION; TANTALUM NITRIDE;

EID: 0031702344 PISSN: 01694243 EISSN: 15685616 Source Type: Journal
DOI: 10.1163/156856198X00678 Document Type: Article

Times cited : (17)

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