Changes in the peeled surfaces of copper thin films deposited on polyimide substrátes after heat treatment

Journal of Adhesion

Volumn 63, Issue 4, 1997, Pages 309-321

  Iwamori, Satoru ^a   Miyashita, Takehiro ^a   Fukuda, Shin ^a   Nozaki, Shouhei ^a   Fukuda, Nobuhiro ^a   Sudoh, Kazufuyu ^a  

^a MITSUI CHEMICALS INC   (Japan)

Author keywords

Adhesion strength; Copper; Copper particle; Heat treatment; Peeled surface; Polyimide

Indexed keywords

ADHESION; COPPER; HEAT TREATMENT; INTERFACES (MATERIALS); LAMINATES; MORPHOLOGY; OPTICAL MICROSCOPY; PEELING; POLYIMIDES; STRENGTH OF MATERIALS; THERMAL EFFECTS; THIN FILMS;

PYROMELLITIC DIANHYDRIDE OXYDIANILIDE;

METALLIC FILMS;

EID: 0030662755     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218469708017225     Document Type: Article

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