Analysis of the T-peel strength in a Cu/Cr/Polyimide system

Acta Materialia

Volumn 50, Issue 16, 2002, Pages 3985-3994

  Song, J Y ^a   Yu, Jin ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Interfacial fracture energy; Peel test; Thin film

Indexed keywords

BENDING (DEFORMATION); CHROMIUM; COPPER; FRACTURE; PEELING; SURFACE CHEMISTRY; THIN FILMS;

INTERFACIAL FRACTURE ENERGIES;

POLYIMIDES;

EID: 0037144298     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(02)00197-0     Document Type: Article

References (12)